Detailed Product Description

Mira^® 30A/B is a two component, room temperature curing paste epoxy adhesive of high strength and toughness. After fully cured it will have high chemical resistance and excellent performance at elevated temperatures. It is suitable for bonding a wide variety of metals, glass and ceramics, rigid plastics and other materials, and is widely used in many industrial applications for resistance to aggressive or warm environments. The low out gassing makes this adhesive suitable for specialist electronic telecommunication and aerospace applications..